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  r09ds0040ej0300 rev.3.00 page 1 of 15 mar 12, 2013 the mark shows major revised points. the revised points can be easily searched by copying an "" in the pdf file and specifying it in the "find what:" field. data sheet ne5550779a silicon power ldmos fet features ? high output power : p out = 38.5 dbm typ. (v ds = 7.5 v, i dset = 140 ma, f = 460 mhz, p in = 25 dbm) ? high power added efficiency : add = 66% typ. (v ds = 7.5 v, i dset = 140 ma, f = 460 mhz, p in = 25 dbm) ? high linear gain : g l = 22.0 db typ. (v ds = 7.5 v, i dset = 140 ma, f = 460 mhz, p in = 10 dbm) ? high esd tolerance ? suitable for vhf to uhf-band class-ab power amplifier. applications ? 150 mhz band radio system ? 460 mhz band radio system ? 900 mhz band radio system ordering information part number order number package marking supplying form ne5550779a ne5550779a-a 79a (pb-free) w8 ? 12 mm wide embossed taping ? gate pin faces the perforation side of the tape ne5550779a-t1 ne5550779a-t1-a ? 12 mm wide embossed taping ? gate pin faces the perforation side of the tape ? qty 1 kpcs/reel NE5550779A-T1A NE5550779A-T1A-a ? 12 mm wide embossed taping ? gate pin faces the perforation side of the tape ? qty 5 kpcs/reel remark to order evaluation samples, please contact your nearby sales office. part number for sample order: ne5550779a absolute maximum ratings (t a = 25 c, unless otherwise specified) operation in excess of any one of these parameters may result in permanent damage. parameter symbol ratings unit drain to source voltage v ds 30 v gate to source voltage v gs 6.0 v drain current i ds 2.1 a drain current (50% duty pulsed) i ds-pulse 4.2 a total power dissipation note p tot 17.8 w channel temperature t ch 150 c storage temperature t stg ? 55 to +150 c note: value at t c = 25 c caution observe precautions when handling because these devi ces are sensitive to electrostatic discharge. r09ds0040ej0300 rev.3.00 mar 12, 2013
ne5550779a r09ds0040ej0300 rev.3.00 page 2 of 15 mar 12, 2013 recommended operating range (t a = 25 c) parameter symbol test conditions min. typ. max. unit drain to source voltage v ds ? 7.5 9.0 v gate to source voltage v gs 1.65 2.20 2.85 v drain current i ds ? 1.4 ? a input power p in f = 460 mhz, v ds = 7.5 v ? 25 30 dbm electrical characteristics (t a = 25 c, unless otherwise specified) parameter symbol test conditions min. typ. max. unit dc characteristics gate to source leakage current i gss v gs = 6.0 v ? ? 100 na drain to source leakage current (zero gate voltage drain current) i dss v ds = 25 v ? ? 10 a gate threshold voltage v th v ds = 7.5 v, i ds = 1.0 ma 1.15 1.65 2.25 v drain to source breakdown voltage bv dss i ds = 10 a 25 38 ? v transconductance g m v ds = 7.5 v, i ds = 490 70 ma 1.26 1.54 2.03 s thermal resistance r th channel to case ? 7.0 ? c/w rf characteristics output power p out f = 460 mhz, v ds = 7.5 v, 37.0 38.5 ? dbm drain current i ds p in = 25 dbm, ? 1.38 ? a power drain efficiency d i dset = 140 ma (rf off) ? 68 ? % power added efficiency add ? 66 ? % linear gain g l note 1 ? 22.0 ? db load vswr tolerance note 2 f = 460 mhz, v ds = 9.0 v, p in = 25 dbm, i dset = 140 ma (rf off) load vswr=20:1(all phase) no destroy output power p out f = 157 mhz, v ds = 7.5 v, ? 38.5 ? dbm drain current i ds p in = 23 dbm, ? 1.36 ? a power drain efficiency d i dset = 140 ma (rf off) ? 69 ? % power added efficiency add ? 67 ? % linear gain g l note 3 ? 24.0 ? db output power p out f = 900 mhz, v ds = 7.5 v, ? 37.4 ? dbm drain current i ds p in = 27 dbm, ? 1.26 ? a power drain efficiency d i dset = 140 ma (rf off) ? 58 ? % power added efficiency add ? 53 ? % linear gain g l note 4 ? 17.0 ? db notes: 1. p in = 10 dbm 2. these characteristics values are measurement usin g measurement tools especially by renesas. 3. p in = 5 dbm 4. p in = 10 dbm remark dc performance is 100% testing. rf performanc e is testing several samples per wafer. a wafer rejection criterion for standard dev ices is 1 reject for several samples.
ne5550779a r09ds0040ej0300 rev.3.00 page 3 of 15 mar 12, 2013 test circuit schematic for 460 mhz c20 c10 in out c22 c11 c12 c13 c21 c1 v ds c1 l1 r1 v gs ne5550779a 50 50 l3 l2 components of test circuit for measuring electrical characteristics symbol value type maker c1 1 f grm188b31c105ka92 murata c10 27 pf grm1882c1h270ja01 murata c11 2.7 pf atc100a2r7jw american technical ceramics c12 12 pf atc100a120bw american technical ceramics c13 12 pf atc100a120bw american technical ceramics c20 24 pf atc100a240jw american technical ceramics c21 6.8 pf atc100a6r8bw american technical ceramics c22 100 pf atc100a101jw american technical ceramics r1 2 k  1/10 w chip resistor koa rk73b1jttd202j l1 114 nh  0.5 mm,  d = 3 mm, 10 turns ohesangyou l2 4.7 nh lqw18an4r7ng00 murata l3 3.0 nh lqp15mn3n0b02 murata pcb ? r1766, t = 0.4 mm,  r = 4.5, size = 30 48 mm panasonic sma connecter ? waka 01k0790-20 waka
ne5550779a r09ds0040ej0300 rev.3.00 page 4 of 15 mar 12, 2013 component layout of t est circuit for 460 mhz c1 c1 c1 c1 r r 1 1 l l 1 1 c1 c1 0 0 c1 c1 1 1 c1 c1 2 2 c c 20 20 c c 21 21 c c 22 22 c1 c1 3 3 l2 l2 l3 l3 rf rf in in rf out rf out v v gs gs v v ds ds c1 c1 c1 c1 r r 1 1 l l 1 1 c1 c1 0 0 c1 c1 1 1 c1 c1 2 2 c c 20 20 c c 21 21 c c 22 22 c1 c1 3 3 l2 l2 l3 l3 rf rf in in rf out rf out v v gs gs v v ds ds
ne5550779a r09ds0040ej0300 rev.3.00 page 5 of 15 mar 12, 2013 typical characteristics 1 (t a = 25 c) r: f = 460mhz, v ds = 3.6/4.5/6/7.5/9 v, i dset = 140 ma, p in = 0 to 30 dbm im: f1 = 460mhz, f2 = 461 mhz, v ds = 3.6/4.5/6/7.5/9 v, i dset = 140ma, p out (2 tone) = 12 to 37 dbm 3rd/5th order intermodulation distortion im 3 /im 5 (dbc) 2 tones output power p out (2 tone) (dbm) im 3 /im 5 vs. 2 tones output power 2nd harmonics 2f 0 (dbc) output power p out (dbm) 2f 0 vs. output power power gain g p (db) power added efficiency add (%) remark the graphs indicate nominal characteristics.
ne5550779a r09ds0040ej0300 rev.3.00 page 6 of 15 mar 12, 2013 test circuit schematic for 157 mhz c20 c10 in out c23 c11 c12 c21 c22 c1 v ds c1 l1 r1 v gs ne5550779a 50 50 l20 l10 components of test circuit for measuring electrical characteristics symbol value type maker c1 1 f grm31mb11e105ka01 murata c10 100 pf gqm1882c1h101jb01 murata c11 5.6 pf gqm1882c2a5r6db01 murata c12 39 pf gqm1882c1h390jb01 murata c20 22 pf grm1882c1h220ja01 murata c21 68 pf gqm1882c1h680jb01 murata c22 15 pf gqm1882c1h150ja01 murata c23 100 pf gqm1882c1h101jb01 murata r1 5.1 k  1/10 w chip resistor roam mcr03j103 l1 74.7 nh  0.4 mm,  d = 2 mm, 10 turns ohesangyou l10 27 nh llq2012-f27n toko l20 29.8 nh  0.4 mm,  d = 2 mm, 5 turns ohesangyou pcb ? r1766, t = 0.4 mm,  r = 4.5, size = 30 48 mm panasonic sma connecter ? waka 01k0790-20 waka
ne5550779a r09ds0040ej0300 rev.3.00 page 7 of 15 mar 12, 2013 component layout of t est circuit for 157 mhz r1 r1 c1 c1 1 1 l l 1 1 c c 20 20 c c 21 21 c c 2 2 3 3 c1 c1 c1 c1 c10 c10 l10 l10 c c 2 2 2 2 l20 l20 in in out out r1 r1 c1 c1 1 1 l l 1 1 c c 20 20 c c 21 21 c c 2 2 3 3 c1 c1 c1 c1 c10 c10 l10 l10 c c 2 2 2 2 l20 l20 in in out out
ne5550779a r09ds0040ej0300 rev.3.00 page 8 of 15 mar 12, 2013 typical characteristics 2 (t a = 25 c) rf: f = 157 mhz, v ds = 3.6/4.5/6/7.5/9 v, i dset = 40 ma, p in = ?10 to 20 dbm add - 3.6 v add - 6 v add - 4.5 v add - 9 v add - 7.5 v p out - 3.6 v p out - 4.5 v p out - 6.0 v p out - 7.5 v p out - 9 v output power p out (dbm) drain current i ds (a) input power p in (dbm) output power, drain current vs. input power 10 0.0 45 3.5 35 40 3.0 2.5 2.0 30 1.5 25 1.0 20 0.5 15 30 15 10 ? 5 05 20 power gain g p (db) power added efficiency add (%) remark the graphs indicate nominal characteristics.
ne5550779a r09ds0040ej0300 rev.3.00 page 9 of 15 mar 12, 2013 test circuit schematic for 900 mhz c21 c10 in out c24 c11 c23 c20 c22 c12 c13 c2 v ds c1 l1 r1 v gs fet ne5550779a 50 50 components of test circuit for measuring electrical characteristics symbol value type maker c10 27 pf gqm1882c1h270jb01 murata c11 6.8 pf gqm1882c2a6r8db01 murata c12 15 pf gqm1882c1h150jb01 murata c13 18 pf gqm1882c1h180jb01 murata c20 8.2 pf gqm1882c1h8r2db01 murata c21 3.9 pf gqm1883c2a3r9cb01 murata c22 1.5 pf gqm1884c2a1r5cb01 murata c23 8.2 pf gqm1882c1h8r2db01 murata c24 100 pf gqm1882c1h101jb01 murata c1 1 f grm21bb31h105ka2l murata c2 1 f grm21bb31h105ka2l murata l1 74.7 nh d20-74n7 ohesangyou r1 20 k  mcr03j203 rohm pcb ? r1766, t = 0.8 mm,  r = 4.8, size = 30 40 mm panasonic sma connecter ? waka 01k0790-20 waka
ne5550779a r09ds0040ej0300 rev.3.00 page 10 of 15 mar 12, 2013 component layout of t est circuit for 900 mhz c1 c1 0 0 c c 11 11 c c 12 12 c c 13 13 c c 20 20 c c 21 21 r1 r1 c c 1 1 l1 l1 rf in rf in v v gs gs v v ds ds c c 22 22 c c 23 23 c c 24 24 c c 2 2 c10 c10 c11 c11 c12 c12 c13 c13 c20 c20 c21 c21 r1 r1 c1 c1 l1 l1 rf in rf in rf out rf out v v gs gs v v ds ds c22 c22 c23 c23 c24 c24 c2 c2 c1 c1 0 0 c c 11 11 c c 12 12 c c 13 13 c c 20 20 c c 21 21 r1 r1 c c 1 1 l1 l1 rf in rf in v v gs gs v v ds ds c c 22 22 c c 23 23 c c 24 24 c c 2 2 c10 c10 c11 c11 c12 c12 c13 c13 c20 c20 c21 c21 r1 r1 c1 c1 l1 l1 rf in rf in rf out rf out v v gs gs v v ds ds c22 c22 c23 c23 c24 c24 c2 c2
ne5550779a r09ds0040ej0300 rev.3.00 page 11 of 15 mar 12, 2013 typical characteristics 3 (t a = 25 c) rf: f = 900 mhz, v ds = 3.6/4.5/6/7.5/9 v, i dset = 40 ma, p in = ?5 to 30 dbm input power p in (dbm) power gain, drain current vs. input power 0 40 30 25 20 15 10 5 0 30 25 20 15 10 5 0 10 25 20 10 5 0 ?10 ?5 15 25 20 10 5 0 ?10 ?5 15 power gain g p (db) power added efficiency add (%) remark the graphs indicate nominal characteristics.
ne5550779a r09ds0040ej0300 rev.3.00 page 12 of 15 mar 12, 2013 s-parameters s-parameters and noise parameters are provided on our web site in a form (s2p) that enables direct import of the parameters to microwave circuit simulators without the need for keyboard inputs. click here to download s-parameters. [products]  [rf devices]  [device parameters] url http://www.renesas.com/products/microwave/
ne5550779a r09ds0040ej0300 rev.3.00 page 13 of 15 mar 12, 2013 mounting layout pad dimensions 79a (unit: mm) 1.7 4.0 0.5 1.0 5.9 1.2 gate source drain 0.5 6.1 0.5 through hole: 0.2 33  stop up the hole with a rosin or something to avoid solder flow. remark the mounting pad layout in this document is for reference only. when designing pcb, please consider workability of moun ting, solder joint reliability, prevention of solder bridge and so on, in order to optimize the design.
ne5550779a r09ds0040ej0300 rev.3.00 page 14 of 15 mar 12, 2013 package dimensions 79a (unit: mm) 0.90.2 0.20.1 0.40.15 5.7 max. 5.7 max. 0.60.15 0.80.15 4.4 max. 4.2 max. source gate drain (bottom view) 3.60.2 1.50.2 1.2 max. 0.8 max. 1.0 max. source gate drain w 8 27001
ne5550779a r09ds0040ej0300 rev.3.00 page 15 of 15 mar 12, 2013 recommended soldering conditions this product should be soldered and mounted under the following recommended conditions. for soldering methods and conditions other than those recommended below, contact your nearby sales office. soldering method soldering conditions condition symbol infrared reflow peak temperature (package surface temperature) : 260 c or below time at peak temperature : 10 seconds or less time at temperature of 220 c or higher : 60 seconds or less preheating time at 120 to 180 c : 120 30 seconds maximum number of reflow processes : 3 times maximum chlorine content of rosin flux (% mass) : 0.2% (wt.) or below ir260 wave soldering peak temperature (molten solder temperature) : 260 c or below time at peak temperature : 10 seconds or less preheating temperature (pack age surface temperature) : 120 c or below maximum number of flow processes : 1 time maximum chlorine content of rosin flux (% mass) : 0.2% (wt.) or below ws260 partial heating peak temperature (terminal temperature) : 350 c or below soldering time (per side of device) : 3 seconds or less maximum chlorine content of rosin flux (% mass) : 0.2% (wt.) or below hs350 caution do not use different soldering methods together (except for partial heating).
all trademarks and registered trademarks are t he property of their respective owners. c - 1 revision history ne555 0779a data sheet description rev. date page summary 1.00 apr 26, 2012 ? first edition issued 2.00 jul 04, 2012 p.2 modification of electrical characteristics p.6 modification of components of test circuit for measuring electrical characteristics 3.00 mar 12, 2013 p3 modification of components of test circuit for measuring electrical characteristics p6 modification of components of test circuit for measuring electrical characteristics p9 modification of components of test circuit for measuring electrical characteristics
notice 1. descriptions of circuits, software and other related information in this document are provided only to illustrate the operat ion of semiconductor products and application examples. you are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. renesas electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 2. renesas electronics has used reasonable care in preparing the information included in this document, but renesas electronics does not warrant that such information is error free. renesas electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. 3. renesas electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property ri ghts of third parties by or arising from the use of renesas electronics products or technical information described in this document. no license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of renesas electronics or others. 4. you should not alter, modify, copy, or otherwise misappropriate any renesas electronics product, whether in whole or in part . renesas electronics assumes no responsibility for any losses incurred by you or third parties arising from such alteration, modification, copy or otherwise misappropriation of renesas electronics product. 5. renesas electronics products are classified according to the following two quality grades: "standard" and "high quality". t he recommended applications for each renesas electronics product depends on the product's quality grade, as indicated below. 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